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  Search result  Your search for [subject]Copper alloys returned 12 records.  
 
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  Book Copper as an alloying element in steel and cast iron.

by Lorig, Clarence Herman, 1900-; New York: McGraw-Hill, 1948.

Subject: Copper steel; Iron alloys; Copper alloys.

 
     
Relevance: 20.07%
 
     
  Analytics On the deviation from random distribution of solute atoms in some copper-based alloys.

by Butt, M.Z.;

Subject: Alloys; Copper alloys; Random distribution.

 
     
Relevance: 18.35%
 
     
  Book The alloys of iron and copper.

by Gregg, James Lawrence, 1899-; New York: Pub. for the Engineering foundation by the McGraw-Hill, 1934.

Subject: Iron alloys; Copper alloys.

 
     
Relevance: 17.68%
 
     
  Book The routine analysis of copper base alloys.

by Versagi, Frank J.; New York: Chemical Pub Co., 1960.

Subject: Copper alloys; Copper--Analysis.

 
     
Relevance: 17.62%
 
     
  Thesis Precipitation hardening of manganese bronze.

by Aguila, Loreta G.; 2002.

Subject: Manganese alloys; Manganese -- Copper alloys; Bronze -- Mettalurgy.

 
     
Relevance: 16.67%
 
     
  Book High conductivity copper alloys; cadmium copper, chromium copper, silver copper, telurium copper.

London: s.n., 1956.

Subject: Copper alloys.

 
     
Relevance: 16.32%
 
     
  Book A.S.T.M. standards on copper and copper alloys, sponsored by A.S.T.M. committee B-5 on copper and copper alloys, cast and wrought, April, 1946.

Philadelphia, Pa.: s.n., 1946.

Subject: Copper; Copper alloys.

 
     
Relevance: 16.29%
 
     
  Book Properties of copper alloys at cryogenic temperatures.

by Simon, N.J.; Gaithersburg, MD: U.S. Department of Commerce, 1992.

Subject: Copper--Thermal Properties; Copper Alloys--Thermal Properties; Low Temperature Research; Metals at Low Temperaturev850CS Library.

 
     
Relevance: 15.91%
 
     
  Thesis Precipitation hardening of manganese bronze.

by Aguila, Loreto G.; 2002.

Subject: Manganese-copper alloys; Precipitation hardening; Metallography.

 
     
Relevance: 15.62%
 
     
  Thesis Thermal aging effects on intermetallic compound growth kinetics and solder joint reliabilty performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish.

by Manauis, Melissa B.; 2007.

Subject: Tin-silver-copper alloys; Solder and soldering.

 
     
Relevance: 15.45%
 
     
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