Search Results       Your search for [subject]Electronic packaging -- Congresses returned 1 record.           Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. New York: The Society, 1991. Subject: Electronic packaging -- Congresses; Microelectronic packaging -- Congresses.          Add to Book Cart Relevance: 18.55%