Search Results       Your search for [subject]Epoxy molding compound returned 1 record.           Local halloysite nanoclay as additive in epoxy molding compound for microelectronics power semiconductor packaging. by Abad, Joseph Jorge Y.; 2011. Subject: Engineering; Halloysite nanotube; HNT; Epoxy molding compound; EMC; Exfoliation; Moisture absorption.          Add to Book Cart Relevance: 26.88%