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  Search result  Your search for [subject]Microelectronic packaging -- Reliability returned 2 records.  
 
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  Book Reliability of electronic packages and semiconductor devices.

by Di Giacomo, Giulio.; N.Y.: McGraw, 1997.

Subject: Semiconductors -- Reliability; Microelectronic packaging -- Reliability.

  
     
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  Thesis The effect of copper oxides on the solder joint reliability of a cu-bumped flip chip package.

by Orofeo, Carlo M.; 2007.

Subject: Microelectronic packaging -- Reliability; Solder and soldering -- Testing; Multichip modules (Microelectronics); Copper oxide superconductor.

  
     
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