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Your search for [subject]PACKAGING returned 380 records. |
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Packaging in the environment.
London: Blackie Academic & Professional, 1993.
Subject: Packaging -- Environmental aspects; Packaging -- Europe; Packaging -- Japan; Packaging -- North America; Product life cycle; Refuse and refuse disposal.
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Cassava starch as alternative loosefill packaging material.
by Gonzales, Nikki Korina L.; Quezon City: PSHS, 2002.
Subject: Packaging materials; Cassava starch -- Loosefill packaging material; Environment-friendly packaging materials; Biodegradable packaging materials.
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Promoting packaging for exporters.
Geneva: The Centre, 1975.
Subject: Packaging; Foreign trade promotion; Packaging -- Bibliography; Packaging -- Directories.
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Framework plan for the development of the Philippine packaging industry.
Pasay City: PHILEXPORT, 1993.
Subject: Packaging -- Philippines; Package goods industry -- Philippines; Packaging -- Malaysia; Packaging -- Thailand.
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Packaging Technology.
Turret West Ltd.
Subject: Packaging -- Periodicals; Packaging -- Technological innovations -- Periodicals; Business, international. -- galestne; Business. -- galestne; Containers and packaging industries. -- galestne; BusinessContainers and packaging industriesBusiness, international; MAG (Magazine/Journal) -- galestne.
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Packaging Magazine.
CMP Information Ltd.
Subject: Package goods industry -- Periodicals; Packaging machinery industry -- Periodicals; Packaging -- Periodicals; Business, international. -- galestne; Business. -- galestne; Containers and packaging industries. -- galestne; BusinessContainers and packaging industriesBusiness, international; MAG (Magazine/Journal) -- galestne.
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Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications.
New York: Wiley, 1995.
Subject: Microelectronic packaging -- Materials; Microencapsulation; Plastics in packaging.
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Product & packaging center to rise in Cebu.
Subject: Packaging plant; Packaging system -- small & medium enterprises.
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Multichip modules : systems advantages, major constructions, and materials technologies.
New York: IEEE Press, 1991.
Subject: Electronic packaging; Microelectronic packaging; Multichip modules (Microelectronics).
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Thermal stress and strain in microelectronics packaging.
New York: Van Nostrand Reinhold, 1993.
Subject: Electronic packaging; Microelectronic packaging; Thermal stresses.
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