Search Results       Your search for [subject]Solder and soldering -- Testing returned 1 record.           The effect of copper oxides on the solder joint reliability of a cu-bumped flip chip package. by Orofeo, Carlo M.; 2007. Subject: Microelectronic packaging -- Reliability; Solder and soldering -- Testing; Multichip modules (Microelectronics); Copper oxide superconductor.          Add to Book Cart Relevance: 24.75%