Search Results       Your search for [subject]Tin-silver-copper alloys returned 1 record.           Thermal aging effects on intermetallic compound growth kinetics and solder joint reliabilty performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish. by Manauis, Melissa B.; 2007. Subject: Tin-silver-copper alloys; Solder and soldering.          Add to Book Cart Relevance: 33.02%